| Id: |
24,292 |
| HS6 Code: |
848690 16 000 0000 0000 |
| Description: |
- - - Of grinding, polishing and lapping machines for processing of semiconductor wafers |
| Specification Code: |
000000 |
| Specification Description: |
Others |
| Valid From: |
01/14/2025 |
| Valid Until: |
01/01/2021 |
| Is Active: |
true |
| Date Created: |
08/16/2020 |
| Last Update: |
09/11/2025 |
|
