| Id: |
24,280 |
| HS6 Code: |
848640 20 000 0000 0000 |
| Description: |
- - Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for the assembly of semicondu |
| Specification Code: |
000000 |
| Specification Description: |
Others |
| Valid From: |
01/14/2025 |
| Valid Until: |
01/01/2021 |
| Is Active: |
true |
| Date Created: |
08/16/2020 |
| Last Update: |
09/11/2025 |
|
