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Specification Code Search
(Matches: hs6code, spc_cod, spc_desc)

SPEC CODE List

HS CODE Description SPEC CODE SPEC DESCRIPTION Active
848620 32 000 - - - Equipment for dry etching patterns on semiconductor materials 000000 Others true
848620 33 000 - - - Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers 000000 Others true
848620 39 000 - - - Other 000000 Others true
848620 41 000 - - - Direct write-on-wafer apparatus 000000 Others true
848620 42 000 - - - Step and repeat aligners 000000 Others true
848620 49 000 - - - Other 000000 Others true
848620 51 000 - - - Dicing machines for scribing or scoring semiconductor wafers 000000 Others true
848620 59 000 - - - Other 000000 Others true
848620 91 000 - - - Lasercutters for cutting contacting tracks in semiconductor production by laser beam 000000 Others true
848620 92 000 - - - Machines for bending, folding and straightening semiconductor leads 000000 Others true
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